ABOUT US
INTRODUCTION

PRODUCT
> RAW MATERIAL OF SOLDER
> INDICATOR SYSTEM OF SOLDER
> TYPICAL PRODUCT OF CLAS
>> LEAD FREE
>> ROSIN SOLDER WIRE
>> BAR SOLDER
>> ANODE
> DIAGRAM Sn-Pb Alloy Phase

PACKING

FLUX

TECHNOLOGIES

QUALITY CONTROL

OFFICE
Jl. Dadap 1, Kav. III
(Dadap Raya)
DS. Dadap, Kec. Kosambi
Tangerang 15211
INDONESIA

PHONE
(+6221) 5595.0742
(+6221) 5595.0744
FAX
(+6221) 5595.0745
EMAIL
clas@citralogam.co.id
www.citralogam.co.id

QUALITY CONTROL

The discrepancies that sometimes exist between National and Defence Specification illustrate the uncertainty that exist regarding the impurity levels that can be tolerated in solders. Usually the purity of solder supplied by reputable solder manufactures is found to be adequate for its purpose, but during use, for example in dip-or wave-soldering, certain metals such as Copper and Zinc dissolve into the solder from the work pieces. Thus the control of contamination is of importance in ensuring the optimum quality of soldering. For impurity analysist in soldering we use Spectrofotometers and Gravimetris methods. To maintain consistently high quality and reliability in soldered assemblies it is essential that a properly planned quality assurance scheme be imposed, one in which every operation which may directly or indirectly influence the perfection of the joints is checked optimum conditions. In particular, attention must be paid to the following items :

1. Consideration of the mechanical design of soldered joint, selec tion of an alloy suitable to withstand the service stress condition and choice of suitable and easily solderable surface finishes for component parts comprising the soldered joints.

2. Control of the soldering operation ( including correct selection of flux ), of temperature-time cycle, maintenance of solder bath composition and, finally,
post-soldering treatment.

3. Solderability testing of materials and components prior to their utilisation on the production line and inspection and testing of the soldered assemblies.