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> DIAGRAM Sn-Pb Alloy Phase

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Diagram of Sn- Pb Alloy Phase

 



Pure tin melts at 232 °C and the melting point of pure lead is 327 °C. When elements are combined, the melting point of the solder formed can be below that of either pure metal. A composition of 63/37% melts at 183, which represents the lowest melting point and most rapid transition from the solid to the liquid state of other tin-lead ratio. The 63/37% solder is termed the eutectic composition. All solder, with the exception of the eutectic compo-sition, which melts sharply from solid to liquid, passes through a stage of softe-ning between its solid and liquid stages known as the PASTY range. A fusion diagram showing the temperature ranges for the various states of solder for all tin-lead combination.

 

Physical Characteristic Chemical Components and Class of Solder

Class / Nature Solid Phase Liquid Phase Specific Gravity Strength of tens. Kg/mm Hardness Conductivity
Cu: 100%

Sn 63 /
37 Pb

183.3

183 - 187
(185)

8.3 - 8.5
(8.4)

5.4

17

11.9

60/40

183.3

186 - 195
(190)

8.4 - 8.6
(8.5)

5.3

16

11.6

55/45

183.3

198 - 207
(203)

8.6 - 8.8
(8.7)

4.5

16

11.1

53/47

183.3

203 - 212
(207)

8.7 - 8.9
(8.8)

4.3

16

10.9

50/50

183.3

210 - 219
(215)

8.8 - 9.0
(8.9)

4.1

14

10.7

45/55

183.3

222 - 231
(227)

9.0 - 9.2
(9.1)

3.9

13

10.3

40/60

183.3

234 - 242
(238)

9.2 - 9.4
(9.3)

3.8

13

9.9

37/63

183.3

240 - 248
(244)

9.3 - 9.5
(9.4)

3.7

12

9.6

30/70

183.3

254 - 262
(258)

9.6 - 9.8
(9.7)

3.6

12

9.3

Ag1 / 60/39

178

183

8.4 - 8.6
(8.5)

5.3

16

11.8 - 12.8

Ag2 / 60/38

178

181

8.4 - 8.6
(8.5)

5.3

16

12.0 - 12.2